Aluminum plate as a kind of metal COINS has very good heat function, its structure is relatively simple, mainly is the circuit layer (copper foil) combined with a layer of insulating layer and the metal base of the three basic components, also the parts are designed into the form of double panel, mainly for high-end equipment design, the structure of the circuit layer as the signal transmission, insulation layer as partition, aluminum as the thermal conductivity and thermal effect, the structure is relatively simple type, it is worth noting that this layer board also has a multilayer, of course, is extremely rare. Structurally, we can say that it is the structure of an ordinary multilayer laminated composite that corresponds to an insulating layer and an aluminum base.

The most important part of the aluminum substrate is the insulation layer, which is also the core technology. It mainly functions as heat conduction and insulation, mainly sticking to the various devices. When choosing such products, general insulation is good or bad directly determine the performance of the product is good or bad, because the most main function is that it is power of the insulation block related to maximum amount of thermal barrier structure. It's not going to work without this. Because the quantity of heat of formation is mainly rely on the device to absorb, to absorb the heat, the more the better the results, at the same time also the more benefit the operation of the reducing device to produce a series of temperature, thereby improving device efficiency and continue to use time. The metal layer has the function coefficient of thermal expansion, which is also the most comprehensive consideration of thermal conductivity. Mature technology should test the cost conditions, the more mature technology, the cost will be likely to be reduced a lot.