The aluminum substrate is a kind of special metal base coated copper plate, because it has good thermal conductivity, heat dissipation, electrical insulation performance and mechanical processing properties are widely used. In the production process of the circuit board manufacturer, it is clear that the aluminum substrate can be divided into three layers, which are the circuit layer (copper foil), the insulation layer and the metal base. The aluminum substrate is widely used in LED, air conditioning, automobile, oven, electronics, street lamps, high power, etc. Why aluminum plates are widely used and used in high-tech products. The thermal expansibility, dimension stability and heat dissipation of the aluminum plate make it meet more demanding products.
Let's take a look at some of the related properties of the aluminum substrate.
Heat dissipation: at present, many double panels, multilayer boards have high density, high power and heat distribution. Conventional printed plate materials such as FR4 and CEM3 are hot bad conductors, insulation between layers, and heat cannot be released. Local heating of electronic devices does not preclude the high temperature failure of electronic components, while aluminum substrate can solve this heat dissipation problem. In addition to the aluminum substrate, the copper substrate has excellent heat dissipation, but the price is very high.
Size stability: aluminum base printing plate, obviously the size is much more stable than the plate of insulation material. Aluminum base PCB, aluminum sandwich board, from 30 ℃ heating to 140 ~ 150 ℃, size of 2.5 ~ 3.0%.
Thermal expansion: thermal expansion and condensation are the common nature of matter, and the thermal expansion coefficient of different substances is different. The aluminum base printing plate can effectively solve the heat dissipation problem, so as to reduce the thermal expansion and shrinkage of the components of the printed board, and improve the durability and reliability of the whole machine and electronic equipment. In particular, the problem of thermal expansion and shrinkage of SMT (surface mounting technology) is solved.
Other reasons: aluminum base printing plate, has the shielding effect; Alternative brittle ceramic substrate; Use of surface mounting technology; Reducing the real effective area of the printing plate; Replace radiator and other components to improve the heat resistance and physical properties of the products; Reduce production costs and labor.